| 摘要 |
<p>PROBLEM TO BE SOLVED: To restrain fine powder from being generated due to shaving of the surface of a chuck kept in contact with a wafer, by a method wherein no protrudent part is present between a suction hole circumferential projection and a peripheral projection protruding upward, and the upside of the peripheral projection is set above that of the suction hole circumferential projection. SOLUTION: A suction hole circumferential projection 7 is provided surrounding a suction hole 4, and a communicating groove 8 which enables the suction hole 4 to communicate with the outer peripheral side of the suction hole circumferential projection 7 is provided. A peripheral projection 6 is provided to the upper outer periphery of a spin chuck 1. No projection is present between the suction hole circumferential projection 7 and the peripheral projection 6 protruding upward, and the upside of the peripheral projection 6 is set slightly higher than that of the peripheral projection 6. By this setup, a wafer 10 is supported with the inner edge 6a of the peripheral projection 6 and the upside of the suction hole circumferential projection 7, so that the contact mark of the spin chuck 1 is markedly lessened in area.</p> |
