Method of modifying an exposed surface of a semiconductor wafer
摘要
A method of modifying an exposed surface of a semiconductor wafer that includes the steps of: (a) contacting the surface with a fixed abrasive article having a three-dimensional textured abrasive surface that includes a plurality of abrasive particles and a binder in the form of a pre-determined pattern; and (b) relatively moving the wafer and the fixed abrasive article to modify said surface of the wafer.
申请公布号
US5958794(A)
申请公布日期
1999.09.28
申请号
US19960694014
申请日期
1996.08.08
申请人
MINNESOTA MINING AND MANUFACTURING COMPANY
发明人
BRUXVOORT, WESLEY J.;CULLER, SCOTT R.;HO, KWOK-LUN;KAISAKI, DAVID A.;KESSEL, CARL R.;KLUN, THOMAS P.;KRANZ, HEATHER K.;MESSNER, ROBERT P.;WEBB, RICHARD J.;WILLIAMS, JULIA P.