| 摘要 |
PROBLEM TO BE SOLVED: To reduce the recess and projection of an insulation layer surface to a specific range and to form a fine circuit appropriately, by forming a sheet shaped insulation resin consisting of an insulation resin film with a copper foil continuously using a series of lines of a heating pressurization roll. SOLUTION: After an inner layer 1 and pads 4 and 4 for connection are formed at a glass epoxy copper-clad lamination plate 3 containing a catalyst with at least two layers through a photo etching process, and insulation resin films 6 and 7 with a copper foil are formed at them in a slightly smooth stage 18 where a surface roughness 18A of an insulation layer 6A is within a range of 3-5μm by lamination using a vacuum laminator with a heating pressurization roll, thus achieving a circuit width of 0.04 mm or higher and a circuit interval of 0.04 mm or higher in circuit formation, and forming a fine circuit in the surface roughess of the surface of the insulation layer 6A. |
