发明名称 HOUSING DEVICE FOR WAFER
摘要 PROBLEM TO BE SOLVED: To surely house a wafer into a cassette. SOLUTION: Concerning a housing device for wafer for moving down a wafer 10 along with a slope 22, on which a liquid flows, and housing the wafer in a housing part 32 located in the liquid under the slope 22, at a lower end part 23 of the slope 22, a flood part 25a and a light receiving part 25b are provided while facing each other and a transmission type sensor device 25 is provided for detecting the passage of the wafer 10 by shielding light flooded from the flood part 25a.
申请公布号 JPH11265922(A) 申请公布日期 1999.09.28
申请号 JP19980068164 申请日期 1998.03.18
申请人 FUJIKOSHI MACH CORP 发明人 DENDA YASUHIDE
分类号 H01L21/677;B65G49/07;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/677
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