Process of making a glass semiconductor package

摘要

A process of making hermetically sealed glass semiconductor packages by injecting molding an electronic device within a body of molten thermoplastic glass which is solidified by cooling. The glass has a sealing temperature not over 350 DEG C. and a CTE not over 110x10-7/ DEG C. and may be made of tin-phosphorus oxyfluoride or lead sealing glasses.