| 摘要 |
PROBLEM TO BE SOLVED: To enable a semiconductor device with a metal reinforcing material to deteriorate less even in a humidity test under strict conditions, by a method wherein the storage elastic modulus of an adhesive agent layer which is provided between the metal reinforcing material and an organic support board and gets completely cured till it finishes releasing all its curing heat release value is set at a specific value at a normal temperature or a specific temperature. SOLUTION: A metal reinforcing material 4 is arranged surrounding a semiconductor chip 2 and bonded to an organic support board 1 through the intermediary of an adhesive agent 5, and outer terminals 7 (solder balls) are provided to the organic support board 1. The adhesive agent layer 5 which bonds the metal reinforcing material 4 to the organic support board 1 is formed of thermosetting adhesive agent, whose storage modulus is in a range of from 10 to 2,000 MPa at a normal temperature or at a temperature of 25 deg.C and in a range of from 3 to 50 MPa at a temperature of 260 deg.C when modulus is measured after the thermosetting adhesive agent finishes releasing all its curing heat release value, whereby a semiconductor device with a metal reinforcing material is capable of meeting requirements such as a humidity resistance cycle and moisture absorption resistance reflow properties. |
