发明名称 |
Low cost hermetic sealed microwave module packaging |
摘要 |
The invention relates to a method for producing low cost hermetic Integrated Module Assembly (IMA) packaging, where an aluminum coating (24) is deposited on a poly-tetrafluoral-ethaline substrate (20), the aluminum coating (24) is selectively etched to form a waveguide window (26) and the substrate (20) is selectively treated over the waveguide window (26) to produce a non-conductive hermetic seal. The substrate (20) is then joined to a metal carrier (28) containing the waveguide (30). As a result of using selectively treated low cost substrates to produce hermetic seals, more expensive substrates are not required to form hermetic seals over substrate to waveguide interconnections.
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申请公布号 |
US5956840(A) |
申请公布日期 |
1999.09.28 |
申请号 |
US19970971155 |
申请日期 |
1997.11.14 |
申请人 |
TRW INC. |
发明人 |
CHAN, STEVEN S.;DOWSING, III, JOHN E.;SNODGRESS, JASON E. |
分类号 |
H01L23/12;H01L23/66;H01P1/08;H01P11/00;(IPC1-7):H01P11/00 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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