| 摘要 |
PROBLEM TO BE SOLVED: To obtain a polishing slurry that can polish composite materials flawlessly in a low surface roughness with high precision in the stepped parts and is useful for polishing semiconductors, magnetic recording heads and the like by dispersing silicon oxide particles and iron oxide particles at a specific ratio in an aqueous medium. SOLUTION: This polishing slurry is prepared by homogeneously dispersing (A) silicon oxide particles and (B) iron oxide particles in (C) an aqueous medium (for example, the average particle size of the components A and B is 0.02-0.2 μm in the aggregate state and its pH is 7.0-7.9. This slurry contains the component A and the component B in amounts of 3-10 wt.% and 0.1-1 wt.%, respectively. For example, this slurry 104 is used for polishing the work 103 made of a composite material from an oxide as aluminum oxide and an iron compound such as iron-tantalum nitride by using a polisher, for example, that is equipped with a rotating lap 101 of a cross lap and the work holder 102 above the lap 101 and the slurry 104 is dripped onto the rotating lap 101. |
