首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
FORMING AND MOUNTING METHOD OF SOLDER BUMP
摘要
申请公布号
JPH11266072(A)
申请公布日期
1999.09.28
申请号
JP19980066591
申请日期
1998.03.17
申请人
MATSUSHITA ELECTRIC IND CO LTD
发明人
MAEDA KEN;SAKAI TADAHIKO
分类号
H05K3/34;(IPC1-7):H05K3/34
主分类号
H05K3/34
代理机构
代理人
主权项
地址
您可能感兴趣的专利
METHOD FOR COMMUNICATING BETWEEN WIRELESS DEVICES AND WIRELESS DEVICE USING SAME
WIRELESS COMMUNICATION APPARATUS AND WIRELESS COMMUNICATION METHOD
Method of Achieving Information, Access Node and Communication Device
APPARATUS, SYSTEM AND METHOD OF DIRECT CURRENT (DC) ESTIMATION OF A WIRELESS COMMUNICATION PACKET
Wireless Network Optimization Appliance
DATA FLOW CONTROL
DYNAMIC, ASYMMETRIC RINGS
Intelligent Network
IDENTIFYING, TRANSLATING AND FILTERING SHARED RISK GROUPS IN COMMUNICATIONS NETWORKS
IP PACKET TRANSMISSION USING VEHICULAR TRANSPORT
UNDERWATER ACOUSTIC NAVIGATION SYSTEMS AND METHODS
COILED TUBING CONDITION MONITORING SYSTEM
ULTRASOUND IMAGING SYSTEM
Memory Architecture With Local And Global Control Circuitry
MAGNETORESISTIVE RANDOM ACCESS MEMORY
POWER MANAGEMENT SRAM GLOBAL BIT LINE PRECHARGE CIRCUIT
POWER CONVERSION DEVICE
METHOD FOR CONTROLLING HARMONICS AND RESONANCES IN AN INVERTER
CONTROL CIRCUIT OF POWER CONVERTER WITH TEMPERATURE CONTROL AND METHOD FOR CONTROLLING POWER CONVERTER
BACKLIGHT MODULE AND DISPLAY APPARATUS
