发明名称 |
Plating process for fine pitch die in wafer form |
摘要 |
Apertures in a tape formed on a substrate allow straight plating of solder bumps to heights above 4 mils. The solder bumps are combined with a lower density material to form an hourglass-shaped structure which allows interconnections to bonding pads of electronic components with pitches less than 9 mils. |
申请公布号 |
US5957370(A) |
申请公布日期 |
1999.09.28 |
申请号 |
US19970781740 |
申请日期 |
1997.01.10 |
申请人 |
INTEGRATED DEVICE TECHNOLOGY, INC. |
发明人 |
GALLOWAY, TERRY R. |
分类号 |
B23K3/06;H05K3/00;H05K3/34;(IPC1-7):B23K31/02 |
主分类号 |
B23K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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