摘要 |
PROBLEM TO BE SOLVED: To enable a semiconductor device package to be less warped, by a method wherein a chamfered part or a curved surface part is provided to the four corners of a ceramic board. SOLUTION: A ceramic board 1 and a resin board 21 are bonded together to form a composite package, and a chamfered part a or a curved surface part b is provided to the four corners of a ceramic board 1 respectively. A chamfered part or a curved part may be provided to the corners of the resin board 21. The composite package equipped with the resin board 21 which is provided with no window is less warped than the composite package equipped with the resin board 21 that is provided with a window. At this point, the chamfered part denotes a part where a corner is obliquely cut off at an angle of 45 deg.. On the other hand, the curved surface part b denotes a part where a corner is cut into a curved surface. By this setup, the composite board composed of the ceramic board 1 and the resin board 21 that are bonded together can be less warped. |