DOUBLE-SIDED BOARD AND ITS MANUFACTURING PROCESS

摘要

FIELD: instrumentation engineering for radio electronics and other industries. SUBSTANCE: manufacturing process includes making depressions for junction holes and flat- bottom depression pattern for conductors and contact pads on non-foiled insulating plate using mechanical milling method followed by deposition of copper layer on two sides of blank obtained and formation of desired physical and electrical structure of board using above-mentioned milling method; bottom layer is produced by evaporating copper in vacuum and then external layer is formed by galvanic plating of copper on bottom layer; desired physical and electrical structure of board is obtained by filling depressions on both sides of board with continuous layers of putty followed by its mechanical grinding over entire length up to external copper layer on board sections between mentioned depressions. EFFECT: improved yield; reduced cost; high precision of manufacturing process. 19 cl, 11 dwg