| 摘要 |
A circuit board for receiving different chip modules at each chip module site has a site for receiving a chip module having electrical connectors thereon and a first set of contacts at the chip module site having a first arrangement for receiving a chip module having an electrical connector footprint conforming to the first module contact arrangement. There is also provided a second set of contacts at the chip module site having a second arrangement for receiving a chip module having an electrical connector footprint conforming to the second module contact arrangement, the second set of contacts having a different arrangement than, and being electrically connected to, the first set of contacts.
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