| 摘要 |
FIELD: indicating arrangements. ^ SUBSTANCE: method comprises coating the face printed circuit of the board with film provided with adhesive layer, gluing the sections of the film that are located above the housings of the light-emitting diodes to the light-emitting surfaces of the diode housings, introducing compound between the film and printed circuit of the board under vacuum, and removing the film from the printed circuit until the compound is completely polymerized. ^ EFFECT: enhanced quality of board. ^ 2 dwg |
