| 摘要 |
PROBLEM TO BE SOLVED: To improve the movement of a stage on which a reticle or a wafer is mounted by changing the exposure order of pattern small regions in every chip exposure when whole chip pattern is made a reduced transfer, by linking reduced images of the pattern small regions on a wafer. SOLUTION: Each three same pattern 1-1 to 1-3 is formed on a wafer and one chip pattern of them links three parts of patterns A, B and C in lateral and covers one unit exposure region 7 which corresponds to these part patterns A, B and C covers in an optical system view 5. Additionally, when each chip pattern 1-1 to 1-3 is projected on the wafer, the chip pattern 1-1 is projected as part patterns A, B and C in order, and next the chip pattern 1-2 is projected as C, B and A in order. Further each chip exposure is changed the chip pattern 1-3 to be projected as A, B and C in order. |
