发明名称 POSITIVE PHOTORESIST COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain the chemically amplifiable positive photoresist high in resolution and heat resistance by incorporating a specified resin and a compound to produce an acid by activated rays or radiation, and the like. SOLUTION: This positive photoresist composition is obtained by incorporating at least the resin of a copolymer having structural units represented by formula I and the compound to produce an acid by irradiation with activated rays or radiation and a solvent. In formula I, R1 is an H or halogen atom or a 1-4 C alkyl group; R2 is a substituent represented by formula II; R3 is a 1-4 C alkyl group; R4 is a 1-8 C straight or branched or cyclic alkyl group; X is a substituent represented by formula III; each of R5 and R6 is, independently, an H or halogen atom or the like; R7 is an H atom or a 1-4 C alkyl group; R8 is an H atom or a 1-8 C straight or cyclic alkyl group or the like; and (n) is an integer of 1-10.
申请公布号 JPH11258805(A) 申请公布日期 1999.09.24
申请号 JP19980059953 申请日期 1998.03.11
申请人 FUJI PHOTO FILM CO LTD 发明人 TAN SHIRO;MIZUTANI KAZUYOSHI;AOSO TOSHIAKI
分类号 H01L21/027;G03F7/004;G03F7/039;(IPC1-7):G03F7/039 主分类号 H01L21/027
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