发明名称 |
NEGATIVE RESIST COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To obtain the negative resist composition suitable for use of light from a <=220 nm exposure light source, especially, ArF excimer laser beams (193 nm) by incorporating specified compounds and resin. SOLUTION: This negative resist composition contains the compound to be allowed to produce an acid by irradiation with activated rays or radiation and the resin having polycyclic alicyclic group and a hydroxyl group and at least one kind of cyclic imido compound represented by the formula in which A is a divalent alkylene group or the like optionally having a hetero atom; B is an optionally substituted trivalent alkylene group or the like; Z1 is an H atom or the like; Z2 is an optionally substituted (m+1)-valent alkylene group or the like; Z3 is an optionally substituted n-valent alkylene group or the like; (m) is an integer of >=1; and (n) is an integer of >=2. The resin having polycylic alicyclic groups and a hydroxyl group has a >=5 C bicyclo group or the like as the polycyclic alicyclic group. |
申请公布号 |
JPH11258801(A) |
申请公布日期 |
1999.09.24 |
申请号 |
JP19980065598 |
申请日期 |
1998.03.16 |
申请人 |
FUJI PHOTO FILM CO LTD |
发明人 |
AOSO TOSHIAKI;KONDO SHUNICHI |
分类号 |
H01L21/027;C08K5/3412;C08L35/00;C08L101/02;G03F7/038;(IPC1-7):G03F7/038 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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