SEMICONDUCTOR DEVICE, AND MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To form a clear mark by raising the mechanical strength of a semiconductor device of such structure that other main face of a semiconductor chip is exposed. SOLUTION: In a semiconductor device 1 of such a structure that other main face of a semiconductor chip 2 where a specified circuit is made in one main face, an external terminal 12 which corresponds to a plurality of electrode pads provided at one main face of the semiconductor chip and is electrically connected to it, a sealing part 14 which covers the pad, and, on the surface of the protective film 4 provided at other main face of the semiconductor chip, a mark 5 are made. Hereby, the mechanical strength of the semiconductor chip can be raised, and the mark recognition in visual inspection can be stabilized.