MANUFACTURE OF MULTILAYERED PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a multilayered printed wiring board-manufacturing method which uses the build-up method and by which the peel strength of a conductor circuit formed by electroless plating can be improved. SOLUTION: After an insulating material layer containing a high polymer component which hardly dissolves in a pre-treating solution for plating and has a sheet forming ability and a hardening resin which easily dissolve in the pre-treating solution for plating after hardening as essential ingredients is formed on a printed board on which a first conductor circuit is formed, an insulating layer is formed by hardening the hardening resin component. The a via hole is formed through the insulating layer and the surface of the insulating layer is roughened by partially dissolving the hardened hardening resin component with the pre-treating solution for plating. Finally, a second conductor circuit is formed on the surface of the insulating layer and internal surface of the via hole by electroless plating.