发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND PHOTORESIST INK FOR PRODUCTION OF PRINTED CIRCUIT BOARD
摘要 <p>PROBLEM TO BE SOLVED: To obtain a photosensitive resin compsn. capable of reducing problems on industrial safety-hygiene, environmental pollution, fire prevention, etc., due to the vaporization of an org. solvent in a process for forming a coating film by coating on a substrate and pre-drying, useful as a photoresist ink for the production of a printed circuit board such as an etching resist ink or a plating resist ink, capable of being made aqueous and developable with water or an aq. dilute alkali soln. SOLUTION: The photosensitive resin compsn. contains (A) a water-soluble photosensitive resin obtd. by introducing styryl pyridinium or styryl quinolinium groups into a polyvinyl alcohol polymer or a water-soluble photosensitive resin obtd. by adding an N-alkylol (meth)acrylamide to a polyvinyl alcohol polymer, (B) a photosensitive prepolymer having both one carboxyl group and at least two ethylenically unsatd. groups in one molecule, (C) a photopolymn. initiator and (D) water.</p>
申请公布号 JPH11258797(A) 申请公布日期 1999.09.24
申请号 JP19980061605 申请日期 1998.03.12
申请人 GOO CHEM IND CO LTD 发明人 MORIGAKI TOSHIO
分类号 H05K3/28;C08F2/46;C08F2/50;C09D11/033;C09D11/10;C09D11/102;C09D11/106;C09D11/107;G03F7/027;G03F7/032;G03F7/033;G03F7/038;H05K3/06;H05K3/18;(IPC1-7):G03F7/038 主分类号 H05K3/28
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