发明名称 LEAD FRAME FOR OPTICAL MODULE, MANUFACTURE OF OPTICAL MODULE AND OPTICAL MODULE
摘要 <p>PROBLEM TO BE SOLVED: To ease stress given from a metal mold to a furrule even if a positioning accuracy to be required in the case of loading a base body having a loaded furrule on a lead frame is eased. SOLUTION: A lead frame 20 is equipped with a die pad 23 having a loading face for loading and fixing an optical module base body 10 with the end face of a furrule 4 having the optical module base body 10 turned toward a fixed direction about a lead frame 20; and die pad supporting parts 24, 25, 26 which are included in a flat plane including the lead frame 20, and have a deformed part for making the position of the die pad 23 displaceable within a flat plane including the lead frame 20 in a direction perpendicular to the fixed direction, and moreover support the die pad 23 to the lead frame 20.</p>
申请公布号 JPH11258467(A) 申请公布日期 1999.09.24
申请号 JP19980065610 申请日期 1998.03.16
申请人 SUMITOMO ELECTRIC IND LTD 发明人 GO HISAO
分类号 H01L23/50;G02B6/42;(IPC1-7):G02B6/42 主分类号 H01L23/50
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