| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an inexpensive resin-sealed semiconductor optical module which is easy of manufacture and is excellent in reliability, and its manufacture. SOLUTION: First resin 21, which is transparent in the wavelength of the light that a laser diode 2 emits and a photodiode 3 receives, is injected and hardened only in the optical coupling space between one light emitting face of the laser diode 2 and the light incident end face of an optical waveguide path 4 and between the other light emitting face of the laser diode 2 and the light receiving face of the photodiode 3, and second resin 22, which is opaque to the light within use environment and besides interrupts moisture, is dropped and hardened to cover the laser diode 2 and the photodiode 3 together with this first resin 21 and the optical waveguide path 4 in its vicinity.</p> |
