| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve a problem in dicing an IC wafer that cutting fluid including chips cut by dicing remains on the IC wafer without being washed off and that the chips are deposited on, dried and fixed to the IC wafer. SOLUTION: In a dicing machine used for dicing an IC wafer, the IC wafer is diced while it is dipper in a cutting fluid and is continuously cleaned after it has been diced. Thus, since the IC wafer is diced, while being immersed in the cutting fluid, the IC wafer is prevented from being dried while being diced, and since it is continuously cleaned after it has been diced, it is cleaned in a state, where the cutting fluid including chips is not dried and fixed to the surface of the IC wafer.</p> |
