| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayered wiring board-manufacturing method by which wiring can be made finer, a thin multilayered wiring board can be manufactured, and then, three or more wiring layers can be laminated upon another in such a state that the layers are surely connected to each other. SOLUTION: Metallic bumps 4 composed of nickel are formed by plating in a prescribed portion on one surface of a conductor layer 1 and an insulating adhesive layer 5 is provided at the portion where the bumps 4 do not exist. Then, after a separate conductor layer 6 is electrically connected to the metallic bumps 4 by sticking the conductor layer 6 to the insulating adhesive layer 5 and, at the same time, bringing the conductor layer 6 into contact with the bumps 4, the conductor layers 1 and 6 are worked to prescribed patterns. |
