| 摘要 |
<p>PROBLEM TO BE SOLVED: To do so that a substrate supported or treated, accompanying with the chucking to a substrate hold table can be separated by knocking up from the substrate hold table timely, without forcing according to the remaining condition of the vacuum chucking force and the throughput efficiency will also not be reduced with high reliability. SOLUTION: In the handling of a substrate 2, wherein after various treatments applied to the substrate 2 held on a substrate holding table 3 the substrate 2 is knocked up and separated from the substrate holding table 3 to prepare for a next treatment, information about the vacuum chucking force of the substrate 2 to the substrate hold table 3 is detected to regulate the knock up, using control means, etc., while the vacuum chucking force is over specified value, when the treated substrate 2 is knocked up and separated from the substrate hold table 3.</p> |
