| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device of a plastic molded type with lead-on-chip(LOC) structure using a double-sided adhesive film for adhesion between a lead frame and a semiconductor chip and which has superior heat- resistance reliability and superior anti-solder reflow-crack property. SOLUTION: In a plastic molded type semiconductor device of an LOC structure, which is manufactured using a double-sided adhesive film constituted of an adhesive layer of at least one layer for the adhesion between a lead frame 3 and a semiconductor chip 2, an adhesive which forms the adhesive layer is of a thermosetting resin composition which has a storage elastic modulus of 10-2,000 MPa at 25 deg.C and 3-50 MPa at 260 deg.C measured by a dynamic viscoelastic property measuring equipment, after being cured to a finished state of 100% heat generation, when a full-cured calorific value is measured with DSC. |
