MANUFACTURE OF MULTILAYERED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a multilayered wiring board manufacturing method by which a multilayered wiring board in which a wiring pattern is formed in a highly uniform thickness can be manufactured by transferring multilayered wiring to one surface of a base substrate for multilayered wiring board by using a plurality of plates for transfer having wiring sections. SOLUTION: In a multilayered wiring board manufacturing method in which wiring 131 is formed by successively transferring the wiring sections composed of conductive layers having prescribed shapes and formed on substrates 110 of a plurality of plates for transfer to a base substrate 180 side for multilayered wiring board by successively press-contacting the plates for transfer having the wiring sections with the base substrate 180, the wiring sections on the substrate 110 are formed by selective plating. At the time of performing selective plating for forming the wiring sections, extra wiring patterns 135 having prescribed shapes are simultaneously plated around the wiring sections and, when the wiring sections are transferred to the base substrate 180, the extra wiring pattern sections 135 are covered with a masking material 160 so as to prevent the transfer of the sections 135 to the substrate 180.