| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayered circuit board, a method for manufacturing the circuit board, and a modifier. SOLUTION: A multilayered circuit board includes a substrate 310, at least one patterned layer made of a conductive material, and at least one resistive layer which is coupled with the substrate 310 and made of a dielectric material. A method for manufacturing the circuit board includes a step of arranging the dielectric layer in parallel with the substrate 310 and laminating an assembly 300 by one time, and then, simultaneously baking the assembly 300. A modifier contains such a material that can facilitate the coupling of the dielectric material to the substrate 31 by softening and smoothing the dielectric material. |
