| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to house an optical semiconductor element and a peripheral semiconductor element in an optical semiconductor device, by mounting the peripheral semiconductor element on one surface of an element mounting substrate having outer connection terminals and electrically connecting to the peripheral semiconductor element mounted on the other surface of the substrate. SOLUTION: A peripheral semiconductor 16 is die-bonded to the lower surface of a lead frame 12 through bonding wires 17, an optical semiconductor element mounting part 13 with the exposed surfaces of a die pad 13a and inner leads 13b is formed on the top face of the lead frame 12, a peripheral element 16 is sealed and a package is molded with a resin. An optical semiconductor element 14 is die-bonded to the die pad 13a of the optical semiconductor element mounting part 13 and wire-bonded to the exposed surface of the inner leads 13b through bonding wires 15. Thus, the glass 20 is adhered and sealed through a sealant 19 after connecting the optical semiconductor element 14 and peripheral semiconductor element 16 through the lead frame 12. |
