发明名称 SUCTION NOZZLE AND ELECTRONIC COMPONENT MOUNTING EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a suction nozzle capable of sucking electronic components different in size. SOLUTION: A plurality of thin holes are formed in a nozzle main body 71. One end of the thin hole is opened in a suction surface 71a. The other end is opened in an interconnection surface 71b interconnected with a vacuum chamber 90 formed on a hollow shaft 23 side. The length L of the thin hole is set in such a manner that a negative pressure necessary for suction in the vacuum chamber in the state that a part of the aperture part of the suction surface 71a is closed is maintained by pressure loss generated in the thin hole interconnected with an aperture part of the suction surface 71a which aperture part is not yet closed.
申请公布号 JPH11261295(A) 申请公布日期 1999.09.24
申请号 JP19980056600 申请日期 1998.03.09
申请人 OHM DENKI KK 发明人 OOKAWA CHIYOUSUKE;OKAZAKI TADAO
分类号 H05K13/04 主分类号 H05K13/04
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