| 摘要 |
A compact soldering apparatus capable of increasing reliability of products by reducing occurrence of dross and using lead-free solder, wherein a primary jet nozzle 1 , a secondary jet nozzle 2 , and a pump (not shown) forming jet waves 24, 25 are installed in a solder tank 6 reservoiring molten solder S. Guide plates 4, 5 are installed between the jet nozzles 1, 2 above a solder face F of the molten solder S on a position where the molten solder is dropped. The guide plates 4, 5 formed into a V-shape are provided with solder guide portions crossing each other so as to drop the molten solder S at different positions on the solder face F of the solder tank 6 . Molten solder dropped onto upper portions of the guide plates 4, 5 passes through the solder guide portions and is made to fall on a nozzle side different to a nozzle side where the solder is flowed.
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