发明名称 |
Circuit board and method for producing the same |
摘要 |
A method for producing a circuit board having a metal circuit pattern on an insulating substrate is provided, including the steps of joining a metal plate onto a surface of the insulating substrate using a hard brazing member containing an active element and removing unnecessary conductive layer portions adjacent a metal circuit pattern of the metal plate to at least partially expose a portion of the surface of the insulating substrate.
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申请公布号 |
US2006191707(A1) |
申请公布日期 |
2006.08.31 |
申请号 |
US20060409880 |
申请日期 |
2006.04.24 |
申请人 |
NGK INSULATORS, LTD. |
发明人 |
ISHIKAWA TAKAHIRO;KIDA MASAHIRO;ISHIKAWA SHUHEI;NAKAYAMA NOBUAKI |
分类号 |
H05K1/00;H05K1/03;H05K3/04;H05K3/06;H05K3/10;H05K3/20;H05K3/38 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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