| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a lead frame which can be constituted easily and which can resist a high-power use. SOLUTION: A lead frame is provided with a die pad which constitutes a semiconductor package together with a molding resin 7, which is exposed on one face of the molding resin 7 and which is depressed so as to be capable of coming into contact with a mounting board. In this case, the die pad is constituted of a chip mounting part 5 on which a semiconductor chip 2 is mounted and of an exposure part 6 which is depressed from the chip mounting part 5, which is exposed on one face of the molding resin 7 and which can come into contact with the mounting board.</p> |
