| 摘要 |
PROBLEM TO BE SOLVED: To minimize the electric characteristic change of a high frequency device and realize a min. connection wiring length with the bump bonding by fixing a reinforcing material having a wider area than a bare chip to the back surface of the bare chip, and fixing the reinforcing material to a wiring board with a resin. SOLUTION: Electrode pads on the surface 1A of a bare chip 1 on which circuit elements of a bare chip 1 are formed are connected through Au bump electrodes 3 to signal/power source wiring connections formed on the top face 2A of a wiring board 2. A reinforcing material 4 larger than the bare chip 1 is fixed to the entire back surface 1B of the bare chip 1. An ultraviolet setting resin 5 is provided and fixed between the side face of the reinforcing material 4, i.e., its part projecting horizontally from the bare chip 1 and the top face 2A of the wiring board 2, whereby the bare chip 1 is in a closed hollow enclosed with the side wall of the ultraviolet setting resin 5, and a resin for protecting the bump connections never penetrates between the bare chip 2 and board 2. |
