| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method and a device for controlling the dicing of a dicing machine which is able to correct the deviation of dicing, without cutting the chip of a semiconductor wafer and having adverse effects on the chip. SOLUTION: A dicing machine 1 has a dummy wafer-housing part and a dummy wafer received in the dummy wafer housing part is carried to a table and placed thereon. Then, this dummy wafer is diced with a blade 68, and the deviation between the center of the dicing and the reference line of a microscope which is caused by the difference in thermal expansion coefficient between the shaft of the blade 68 and the microscope is calculated. The amount of pitch feed in a Y-direction of the next street is corrected by the use of the correction data of the calculated deviation, and then the next street is diced.</p> |
