| 摘要 |
PROBLEM TO BE SOLVED: To enhance the heat radiating property while preventing the drop of moisture resistance or the external appearance of a resin sealed body. SOLUTION: A press part 20 is cut and erected in advance in a heat sink 15 coupled with a tab 16, and when molding a resin sealing body 25, the bottom of the tab 16 is exposed at the bottom of the resin sealing body 25 by pressing the pressing part 20 by the ceiling face of a cavity thereby pressing it against the bottom of the cavity. The top end of the pressing part 20 is exposed at the topside of the resin sealing body 25. Hereby, since the bottom of the tab is exposed at the bottom of the resin sealed body, the heat radiation property of a semiconductor device is improved. Since the pressing part is sealed with the resin sealing body, the drop of the moisture resistance to a pellet and the drop of external appearance of the resin sealing body can be prevented. |
