| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for mounting an IC chip, capable of high density mounting at low cost, at the connecting of a semiconductor integrated circuit element to a circuit board. SOLUTION: A bonding pad 5 of a semiconductor integrated circuit element 3 is composed of an oxidizing conductive resin, and a cover 6 constituted of flexible non-oxidizing conductive resin is provided on the upper face of the bonding pad 5. Also an oxidizing conductive resin 7 is provided at a connecting part with the semiconductor circuit element on a conductive pattern 2 on a circuit substrate 1, and a flexible non-oxidizing resin cover 8 is provided on the upper face of the conductive resin 7. Then, the semiconductor circuit element is jointed with the circuit substrate 1 by a wedge-shaped conductive protrusion 4.</p> |
