MANUFACTURE OF MULTILAYERED WIRING BOARD AND MULTILAYERED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a multilayered wiring board manufacturing method by which wiring sections can be transferred at a high yield by successively transferring the wiring sections of a plurality of plates for transfer having the wiring sections to a base substrate for multilayered wiring board by successively press- contacting the plates to one surface of the base substrate. SOLUTION: In a multilayered wiring board manufacturing method, wiring is formed on a base substrate for multilayered wiring board by successively transferring the wiring sections 120 composed of conductive layers having prescribed shaped and formed on substrates 110 of a plurality plates for transfer having the wiring sections 120 and viscous or adhesive insulating resin layers 130 on the wiring sections 120 to the base substrate side with the insulating resin layers 130 in between by successively press-contacting the plates with one surface of the base substrate. The substrate 110 of each plate for transfer is stripped off after the plate is presscontacted with the surface of the base plate and the tensile break strength of the insulating resin layer 130 is improved through heat treatment.