PREPARATION OF COPPER SURFACE FOR IMPROVING BONDING, COMPOSITION USED THEREIN AND PRODUCT MANUFACTURED THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a copper or copper-alloy substrate having an adhesive property against an organic material. SOLUTION: A method for manufacturing a substrate by preparing a surface which can form a cocontinuous bond includes a process of obtaining a copper or copper-alloy substrate and a process of applying an etching composition to the substrate. The etching composition contains (a) an acid, (b) an oxidizing agent, (c) a copper complexing agent, and (d) a copper complex with the copper complex being contained in the composition at such a content that the complex settles when the complex is applied to the copper of copper-alloy substrate.