发明名称 SAMPLE TO BE CHUCKED
摘要 <p>PROBLEM TO BE SOLVED: To provide a sample to be chucked for evaluation of an electrostatic chuck. SOLUTION: For a body to be chucked 1 by an electrostatic chuck, at least a part of a chucking fast of the body 1 is made of a conductor 2 such as silicon wafers, a means is provided for jetting compressed gas on the chucking face of the electrostatic chuck. As the compressed gas jetting means, a porous body 3 is mounted on the outside of the conductor 2, by constituting the body to be chucked and a gas jetting face of the porous body 3 is exposed on the chucked face, to make it capable of embodying.</p>
申请公布号 JPH11260898(A) 申请公布日期 1999.09.24
申请号 JP19980057834 申请日期 1998.03.10
申请人 NIPPON STEEL CORP 发明人 MUKAI TOSHIO
分类号 B23Q3/15;F16C32/06;H01L21/68;H01L21/683;(IPC1-7):H01L21/68 主分类号 B23Q3/15
代理机构 代理人
主权项
地址