| 摘要 |
PROBLEM TO BE SOLVED: To enable the top electrode of a surface projecting semiconductor light-emitting device to be connected electrically to a wiring pattern formed on a board without using wires. SOLUTION: Recesses 22 and 23 are provided to the underside of a top electrode connecting member 20 which communicates with a light extracting hole 25 provided to the top of the connecting member 20. A light-emitting device 10 is housed in the recess 22. The recess 23 and the light extracting hole 25 are located above the light-emitting device 10. A metal film 24 is formed on the sidewalls of the recesses 22 and 23 which extend up to the base of the top electrode connecting member 20. The top electrode 11 of the light-emitting device 10 is brought into contact with the step portion of the metal film 24, located at a boundary between the recesses 22 and 23. The top electrode 11 of the light-emitting device 10 is connected electrically to a wiring pattern 32 on a mounting board 30 via a metal film 24. Light emitted from the light- emitting device 10 is directed towards the light extracting hole 25, reflected from the metal film 24 formed in the recess 23, and projected to the outside passing through the light extracting hole 25. |
