| 摘要 |
The carrier plate (1) can be mounted on a base and has on one side spacers, as individual bumps, securable to the plate. They can be formed integrally with the plate by injection molding from plastics. The bumps may be in form of deposition faces e.g. in the region of fastening bores. Several carrier plates can be vertically stacked in a magazine (23) in readiness for farther processing and may have struts for securing of the stacked plates. A mandrel (25) may support the plate stack in the magazine.
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