| 摘要 |
<p>A semiconductor device composed of a semiconductor chip, a wiring board which is provided so as to surround the semiconductor chip, leads which protrude from the wiring board and are connected to the semiconductor chip, a reinforcing member which is provided on one main surface of the wiring board and surrounds the semiconductor chip, a plurality of bumps which are provided along the peripheral edge of the wiring board on the other main surface of the board on the opposite side of the reinforcing member, and a resin which covers the semiconductor chip and the leads. The leads connected to the semiconductor chip are bent toward the surface of the reinforcing member or the surface of the bumps and connected to the semiconductor chip so that the surface opposite to the surface of the semiconductor chip connecting to the leads may be positioned on the side opposite to the side on which the leads are bent.</p> |
