Semiconductor component with a chip having a lead-on-chip structure mounted on a lead structuring substrate

摘要

A semiconductor component has chip outer electrodes with gold or tin connection sections soldered to tin or gold connection sections of a substrate lead structure by a gold-tin solder. A semiconductor component comprises: (1) a chip with several outer electrodes with connection sections of gold or tin; (2) an insulating substrate with a lead structure, each lead having an inner lead with a connection section of tin or gold which is soldered by a gold-tin solder to a corresponding connection section of a chip outer electrode; and (3) molded resin for enclosing the connected sections including the solder. Independent claims are also included for the following: (i) an electronic device with a RAM-bus-semiconductor component module comprising several of the above components mounted on a RAM-bus-lead structuring substrate; (ii) a flexible TAB lead structuring substrate comprising a non-perforated flexible insulating foil with a rolled lead foil of oxygen-free copper of /-99.99 wt.% purity, a high purity electrolytic copper foil, a deposited copper layer or an electroless copper coating; and (iii) processes for producing the above component.