| 摘要 |
A circuit board fabrication method and system is disclosed in which circuit boards are fabricated by adhesively applying circuit conductive traces to a circuit board substrate and subsequently affixing the arrangement of the circuit traces on the substrate by encapsulating and embedding the circuit traces within a circuit board covering material that becomes flowable and adhesive when subjected to heat and pressure. In one embodiment, the circuit traces are created and applied to circuit board substrate areas by a punch and die assembly. A sheet of circuit trace material is provided between plates of the apparatus wherein the plates have matching circuit trace shaped cut-outs. Punch elements having a mating circuit trace shape are slidable within the cut-outs wherein a circuit trace is punched from the circuit trace material when the punch elements slide between the plates. After a circuit trace is punched, the punch elements then stamp the circuit trace to the substrate. Since the circuit trace material includes a conductor and an adhesive layer, the circuit traces adhesively bind to the substrate during the circuit forming process. Further, a dielectric layer, which may be part of the adhesive layer, allows such circuit traces to be iteratively disposed on top of one another substantially without concern for electrical interference at circuit trace overlaps. |
