发明名称 |
Device for monitoring chip temperature |
摘要 |
A device for monitoring chip temperature of a switch output stage having a switch element (100, 106) that has a first circuit (10) for generating a signal (pvon) corresponding to the dissipated power of the switch element (100-106) during an on state. The device has a second circuit (20) for generating a signal (pv1, pv2; pv'1) corresponding to the dissipated power of the switch element (100-106) during a turn-on and/or turn-off event. The device further has a summer (40) that sums the signals (pvon, pv1, pv2; pvon pv'1) of the first and second circuits (10, 20) in weighted fashion and outputs a sum signal (pvsum) corresponding to the dissipated power of the switch element (100-106). The device also has an integrator (60) that responds to the sum signal (pvsum) and outputs an output signal (th) corresponding to the chip temperature of the switch element (100-106). Such a device is suitable for temperature monitoring in realtime at switch output stages having variable switching frequency.
|
申请公布号 |
US5955909(A) |
申请公布日期 |
1999.09.21 |
申请号 |
US19970940522 |
申请日期 |
1997.09.30 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
LENZ, HELMUT;BURGER, WALTER |
分类号 |
H02H6/00;(IPC1-7):G06G7/42 |
主分类号 |
H02H6/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|