发明名称 Device for monitoring chip temperature
摘要 A device for monitoring chip temperature of a switch output stage having a switch element (100, 106) that has a first circuit (10) for generating a signal (pvon) corresponding to the dissipated power of the switch element (100-106) during an on state. The device has a second circuit (20) for generating a signal (pv1, pv2; pv'1) corresponding to the dissipated power of the switch element (100-106) during a turn-on and/or turn-off event. The device further has a summer (40) that sums the signals (pvon, pv1, pv2; pvon pv'1) of the first and second circuits (10, 20) in weighted fashion and outputs a sum signal (pvsum) corresponding to the dissipated power of the switch element (100-106). The device also has an integrator (60) that responds to the sum signal (pvsum) and outputs an output signal (th) corresponding to the chip temperature of the switch element (100-106). Such a device is suitable for temperature monitoring in realtime at switch output stages having variable switching frequency.
申请公布号 US5955909(A) 申请公布日期 1999.09.21
申请号 US19970940522 申请日期 1997.09.30
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 LENZ, HELMUT;BURGER, WALTER
分类号 H02H6/00;(IPC1-7):G06G7/42 主分类号 H02H6/00
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