发明名称 |
Apparatus and process for improved die adhesion to organic chip carriers |
摘要 |
A semiconductor package and method for preparing same to obtain improved die adhesion to organic chip carriers has been developed. A copper die bond pad is coated with a passivation material and attached to an organic card with the same passivation material. A semiconductor die may be adhered to the coated die bond pad with either the same passivation material or a common die bond adhesive. Alternatively, the passivation material is coated only on the portion of the die bond pad where the die is attached, and common die bond adhesive attaches the die bond pad to the organic card. |
申请公布号 |
US5955782(A) |
申请公布日期 |
1999.09.21 |
申请号 |
US19970964037 |
申请日期 |
1997.11.04 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
KOSTEVA, STEPHEN JOHN;PASSANTE, DAVID MICHAEL;RUDIK, WILLIAM JOHN;RUSSELL, DAVID JOHN;WHITCOMB, JONATHAN CRAIG |
分类号 |
H01L21/60;(IPC1-7):H01L23/34 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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