发明名称 |
High density single inline memory module |
摘要 |
A high density single inline memory module (140) comprising a printed circuit board (132) and at least one integrated circuit module (130) attached to the first side (134) of the printed circuit board (132), wherein the integrated circuit modules (130) each including first and second integrated circuit packages (30) stackably and electrically connected together is disclosed.
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申请公布号 |
US5956233(A) |
申请公布日期 |
1999.09.21 |
申请号 |
US19970994625 |
申请日期 |
1997.12.19 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
YEW, CHEE KIANG;ENG, KIAN TENG;KHOO, SIAN YONG;SER, BOK LENG |
分类号 |
H01L25/065;H05K1/18;H05K3/34;H05K7/02;(IPC1-7):H05K7/02 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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