| 摘要 |
An apparatus for processing a workpiece is provided to read characteristic information of a wafer from a light-readable apparatus without undulating the workpiece by performing a peeling process, a reading process and an attaching process without separating the workpiece from a second support table. A surface protection film peeling unit peels a surface protection film attached to the front surface of a workpiece(60) by using peeling tape. A bar code attaching unit(11) attaches a corresponding bar code to the workpiece. A movable support table supports the workpiece. While the workpiece is supported by the support table, a surface protection film attaching process is performed on the workpiece by the surface protection film peeling unit and a bar code attaching process is performed by the bar code attaching unit. A cleaning unit cleans the workpiece, disposed in the upper steam of the surface protection film peeling unit in the transfer direction of the support table. |
