发明名称 |
Injection molded thermal interface system |
摘要 |
A printed circuit board assembly that has a heatpipe. The assembly includes an integrated circuit package that is mounted to a printed circuit board. The heatpipe is attached to a plastic mold that is mounted to the printed circuit board. When assembled to the circuit board, the heatpipe is thermally coupled to the integrated circuit package. The plastic mold is lightweight and relatively inexpensive to produce. The mold also provides enough structural rigidity to prevent warping of the heatpipe.
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申请公布号 |
US5956229(A) |
申请公布日期 |
1999.09.21 |
申请号 |
US19980053238 |
申请日期 |
1998.04.01 |
申请人 |
INTEL CORPORATION |
发明人 |
BROWNELL, MICHAEL;MCCUTCHAN, DAN;XIE, HONG;HALEY, KEVIN |
分类号 |
H01L23/427;H01L23/433;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/427 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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